Inspection Standards:
IPC/JEDEC J-STD-035 Acoustic Microscopy Inspection Methods for Non-Hermetically Sealed Packaged Components, 
IPC/JEDEC J-STD-020 Moisture/Solder Rebond Sensitivity Classification of Non-Hermetically Sealed Solid State Surface Mounted Components,
IPC/JEDEC J-STF-020 Moisture/Reflow Sensitivity Classification of Plastic Integrated Circuit SMDs

Description:

Detection of voids/delaminations/cracks within a sample using ultrasonic pulses.