Testing standard: GJB 360B-2009

Description: For the chip can not be detected directly by the appearance of the location, the use of X-Ray penetration of different densities of different changes in the intensity of light, resulting in the formation of contrasting effects can be formed images, which can show the internal structure of the object to be tested, so as to achieve the case of samples to be tested without destroying the internal defects of the chip to be nowhere to hide.

X-Ray Inspection Procedure:
Confirmation of the sample type/material to be tested and the test location and requirements.
Place the sample into the X-Ray inspection table for X-Ray inspection→.
Image judgment and analysis→ Mark the defect type and location.

Applications:

Defect detection of cracks and foreign objects inside metal materials and parts, plastic materials and parts, electronic components, electronic assemblies, LED components, etc., analysis of internal displacements of BGA, circuit boards, etc., and analysis of BGA welding defects such as identification of empty welds and false welds.